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Introduction of Package and Substrate Design Technology

We provide a service for the development and prototype production for the customerWe are able to develop not only the general plastic package, CSP, BGA ball type package but also SiP, stuck structure package and module.

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IC Package
 
Module
 
Simulation

Thermal Simulation

Stress Simulation

Electrical Simulation
 
Evaluation
 
Packing Design

 
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