| Object： |
Packing material for semiconductor package and module
- Individual packing is possible
（General design of tray, emboss carrier tape and tube etc.）
- Possible to design inner and external box
（Possible to design buffer material and containing sac etc.）
|
| Feature： |
Deployment of individual packing design is very quick because the package and module design is performed internally.
- Possible to perform the peeling characteristics evaluation of emboss carrier tape
- Possible to perform drop test and evaluation of packing materials.
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