Wave Technology Inc.

Semiconductor package, Module, Package materials

1. It is possible to do the soldering strength measurement and the evaluation of IC lead/solder ball and the substrate
2. It is possible to do the section polishing (observation) and evaluation of soldering part and cracked part.
3. It is possible to do peel off evaluation of emboss carrier tape.
4. It is possible to perform drop test and evaluation of packaging material.

Deployment is very quick because all package, module, package material are designed inside.

1. All can be designed such as the lead frame/substrate design needed for the package development and the drawing needed for assembly (including tool design), package materials.
2. We can provide the design considering the feature of the structures using the simulation.
3. We can provide the design considering the production process because we have the business networks connected to package production factories.