| Object： |
Thermal simulation, Stress simulation, Electrical simulation
- The analysis by 2D and 3D models are possible which are useful for the development of semiconductor package, module and substrate.
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| Feature： |
The most suitable package development becomes possible by doing the feedback of the simulation result to the design
- Thermal simulation
- Stationary and transient analysis
- Analysis of package thermal characteristics (thermal resistance θja） and extraction of the chip junction temperature.
- Stress simulation
- Non linear analysis
- Extract warpage and effect of the temperature dependency
※ Stress, warpage, shape variation, stress point life expectation cycle etc.
- Electrical simulation
- Analyze the electrical characteristics of the packaging
- LCR, delay time of input signal etc.
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