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Module
Object:

COB type module
Surface mounting type module

  1. Mobile phone module etc. (camera module, SW/FE module)
    Wiring pattern design is possible for analog/digital mixed circuit.
  2. Wiring pattern design is possible for high frequency product module
Feature:

When the circuit drawing is supplied, the module prototype and development (up to sample delivery) is possible.

  1. We can provide all design such as substrate pattern design that is needed for the module development, drawings (including design of tools) that is needed for assembly and package materials.
  2. We can provide the design considering the features of the structure using the simulation.
  3. We can provide the design considering the production process because we have the business networks connected to package production factories.
 
Customer
Circuit information
Internal Wiring Design

Printed circuit board wiring design

Perform printed circuit wiring pattern design for addable memory of PC and several modules for mobile telephones.
Structure review and simulation
To Mechanical design
Specification drawing for assembly(Package related drawing)

Module related design

Drawing of wire connection
Drawing of mounting parts
Drawing of assembly,

Outline drawing
Drawing of marking

Tool design

Drawing of Carrier tool
Drawing of solder print tool

Prototype
We have business networks that are connected to semiconductor factories of Mitsubishi Electric Corp. and Renesas Technology Corp. and its subsidiaries.
Evaluation
Shipping

Shipping box design

Inner box
External box

Customer
Package delivery

 
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