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High Frequency and Optical device
High frequency and Optical device Category
Consignment service of high frequency circuit design
Example of high frequency amplifier design
Consignment of design and production of high frequency semiconductor product test tool
Package and Substrate Design
ICPackage
Module
Simulation
Thermal simulation
Stress simulation
Electrical simulation
Evaluation
Packing Design
Sensor・HIC
Semicondustor Pressure Sensor Design
Analog Semiconductor test Tool Design
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IC Package
Object：

General plastic package
CSP,BGA,LGA array type package

  1. It is possible to provide SiP or stack structure packaging.
  2. It is possible to correspond to all types of products such as memory, microcomputer, ASIC Composite IC etc.
Feature：

When you supply us an IC chip, we can provide you package prototype development (sample delivery)

  1. We can provide all designs such as lead frame/substrate design that is needed for the package development and drawings (including design of tools) that is needed for assembly and package materials.
  2. We can provide the design considering the features of the structure using the simulation.
  3. We can provide the design considering the production process because we have the business networks connected to package production factory.
　 General Plastic Package Ball Array Package such as CSP,BGA
Customer
Connection information between chip-IC lead
Connection information between chip-ball land
Internal wiring design
IC Lead Frame Design
Printed circuit board wiring design
As for lead frame type of IC package, the lead frame is realized taking into account the high thermal dissipation heat sink as well as the stack structure such as SiP, MCP.
Wiring pattern design of the package substrate is performed for ball grid array type such as FBGA, FC-BGA.In addition, the substrate design for package evaluation is performed.
Structure review and simulation
To mechanical design
Specification drawing for assembly（Package related drawing）

Package related design

Drawing of wire connection
Drawing of assembly
Drawing of marking
Outline drawing

Tool Design

Drawing of Carrier tool
Drawing of solder print tool
Prototype production
We have business networks that are connected to semiconductor factories of Mitsubishi Electric Corp. and Renesas Technology Corp. and its subsidiaries.
Evaluation
Shipment

Individual package design

Emboss carrier
Tray
Tube

Shipping box design

Inner box
External box
Customer
Package delivery

 
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